[:en]Multi-core chips are now common and, as they continue to scale up, processors will become the equivalent of a computer cluster on a single die. Therefore, high-bandwidth and low-latency interconnects will be necessary to fully exploit the processing power of these chips. However, current electrical interconnects cannot be scaled to meet the requirement of future high performance electronic circuits because of power dissipation limitations. Silicon photonics has demonstrated that it is possible to build CMOS compatible optical components. However, these require a different wafer structure than state-of-the-art electronics and are therefore not suitable for on-chip interconnects. Therefore, we are investigating novel multi-layer optical waveguide architectures implemented with materials deposited at low temperature that provide a high refractive index contrast.[:fr]Les puces multi-c\u0153urs sont d\u00e9sormais courantes et bient\u00f4t les processeurs deviendront l’\u00e9quivalent d’une grappe de calcul sur une seule puce. Par cons\u00e9quent, des interconnexions \u00e0 large bande passante et \u00e0 faible latence seront n\u00e9cessaires pour exploiter pleinement la puissance de ces puces. Cependant, les interconnexions \u00e9lectriques actuelles ne peuvent pas \u00eatre mises \u00e0 l’\u00e9chelle pour r\u00e9pondre aux exigences des futurs circuits \u00e9lectroniques de haute performance en raison des limites sur la dissipation de chaleur. La photonique sur silicium a d\u00e9montr\u00e9e qu’il est possible de construire des composants optiques compatibles avec les proc\u00e9d\u00e9s CMOS. Toutefois, ceux-ci exigent une structure de gaufre diff\u00e9rente que celle utilis\u00e9e pour l’\u00e9lectronique avanc\u00e9e et ne conviennent donc pas pour les interconnexions optiques sur puce. Nous d\u00e9veloppons donc un nouveau proc\u00e9d\u00e9 de fabrication de guides d’onde optiques, compatible avec les circuits CMOS, qui utilise des mat\u00e9riaux d\u00e9pos\u00e9s \u00e0 basse temp\u00e9rature et qui offrent un contraste d’indice de r\u00e9fraction \u00e9lev\u00e9.[:]<\/p>\n","protected":false},"excerpt":{"rendered":"
[:en]Multi-core chips are now common and, as they continue to scale up, processors will become the equivalent of a computer cluster on a single die. Therefore, high-bandwidth and low-latency interconnects will be necessary to fully exploit the processing power of…
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